Business Description
DISCO makes precision cutting, grinding and polishing machines for semiconductor and electronic-component manufacturing, together with the consumable blades and grinding wheels those machines use. Its dicing saws and wafer grinders hold the leading share worldwide, and the consumables provide a large stream of recurring revenue that smooths the equipment cycle.
Advanced packaging has become the main growth driver: stacking and thinning chips for high-bandwidth memory and AI accelerators requires far more grinding and dicing steps than conventional assembly. Founded in 1937 as a grinding-wheel maker in Hiroshima and incorporated in 1940, the company is known in Japan for an unusual internal management system in which departments buy and sell work from each other at internal prices.
Corporate Data
| Ticker | 6146 |
|---|---|
| Exchange | Tokyo Stock Exchange |
| Size Category | TOPIX Large70 |
| Market Segment | Prime Market |
| Sector | Machinery |
| Head Office | 2-13-11 Omorikita, Ota-ku, Tokyo 143-8580, Japan |
| Founded | March 2, 1940 |
| Fiscal Year End | March 31 |
| Website | Official website |